SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its ...
Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.
Samsung has announced the availability of its HybridSubstrate Cube dubbed the H-Cube earlier today, November 11. This is the South Korean tech company's latest 2.5D semiconductor packaging option.
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