Abstract: Fully subtractive TopVia Ru interconnects with embedded airgap have been demonstrated through spacer assisted litho-etch litho-etch (SALELE) patterning, which utilizes a novel spacer pull ...
Abstract: Ruthenium (Ru) and Copper (Cu) interface promotes void-free Cu gap-fill through a Cu reflow approach. However, reliability issues such as Electromigration (EM) and time-dependent dielectric ...
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